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Capabilities for PCB, FPC and PCBA
 Publish at:2012年12月07日 Views:1805

PCB Capability:

 

Item

Mass Production

Sample

Max. Layers

20 Layers

30 Layers

Max. Board Size

21"x24"

24"x40"

Material

FR4,High Tg, Bergquist material, PT material, etc.

Rogers, Nelco, Telfon, etc.

Max. Board Thickness

6.0mm

8.0mm

Min. Core Thickness

0.10mm

0.075mm

Min. Track Width/Space

3.5mil/3.5mil

2.5mil/2.5mil

Max. Copper Thickness

Inner Layer:6Oz

Inner Layer:8Oz

 

Outer Layer:8Oz

Outer Layer:12 Oz

Min. Drill Size

0.2mm

0.15mm

Min. Laser Drill Size

0.1mm

0.076mm

PTH Diameter Tolerance

±3mil

±2mil

Aspect Ratio

10:1

15:1

PTH Wall Thickness

18um-25um

16um-35um

Min solder mask bridge

0.13mm

0.10mm

Min solder mask window

0.10mm

0.08mm

V-cutting Tolerance

±0.13mm

±0.10mm

Outline Dimension

±0.13mm

±0.10mm

Warp and Twist

≤0.7%

≤0.5%

Plating Hard Gold

50”

200”

Controlled Impedance

±10%

±7%

HDI Board

1+N+1, 1+1+N+1+1

2+N+2,  3+N+3

Surface Treatment

HASL with Lead

HASL with Lead

HASL Lead Free

HASL Lead Free

Immersion Gold

Immersion Gold

Immersion Tin

Immersion Tin

Immersion Silver

Immersion Silver

Flash Gold

Flash Gold

OSP

OSP

Gold Finger

Gold Finger

Selective hard gold

Selective hard gold

 


 

FPC Capability:

 

Materials

Kapton, Polyimide, PET

FR4 for Rigid

Stiffener Materials

Polyimide, PET, FR4, SUS

 

Flexible Board Layers

1-4 Layers

Prototype 6 Layers

Rigid-Flex Board Layers

2-10 Layers

Prototype 12 Layers

Max. Panel Size

250mm*400mm

12.6mm*30m, The whole roll production

Min.Track Width/Space

0.051mm/0.076mm

0.051mm/0.051mm

Min. Board Thickness

Single0.1mm

 

2 layers0.13mm

 

4 layers0.30mm

 

6 layers0.50mm

 

Min. Hole Size

Drill Hole:0.20mm

0.15mm for Prototype

Punching Hole0.50mm

 

Aspect Ratio

6:1

8:1

Base Copper

1/3Oz--2Oz

3 Oz for Prototype

Size Tolerance

Conductor Width±10%

W ≤0.5mm

Hole Size ±0.05mm

H ≤1.5mm

Hole Registration ±0.050mm

 

Outline Tolerance±0.075mm

L ≤50mm

Surface Treatment

ENIG: 0.025um - 3um

 

OSP:

 

Immersion Tin: 0.04-1.5um

 

Dielectric Strength

AC500V

 

Solder Float

288/10s

IPC Standard

Peeling Strength

1.0kgf/cm

IPC-TM-650

Flammability

94V-O

UL94

 

 

PCBA Capability:

 

Type of assembly

THD (Thru-hole device) / Conventional

SMT (Surface-mount technology)

SMT  & THD mixed

Double-sided SMT and/or THD assembly

Components

Passives, smallest size 0201

Fine pitch to 08 Mils

Leadless chip carriers/ BGA, VFBGA,  FPGA & DFN

Connectors and terminals

Component packaging

Reels

Cut tape

Tube

Loose parts

Board dimensions

Smallest size: 0.25”x0.25”,6mmx6mm

Largest size: 15.75″ x 13.5″,400mmx340mm

Board type

Rigid

Flexible

Rigid-flexible

Solder Type

Leaded and Lead-Free

Water soluble solder paste

Manual soldering for special parts, e.g. wires and temperature sensitive parts.

Design file format

Gerber RS-274X, 274D, Eagle and AutoCAD’s DXF, DWG

BOM (Bill of Materials)

Pick and Place file (XYRS)

 

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